Rogers RO3010 4-Layer 2.6mm PCB with Immersion Tin Surface
1.Introduction
Rogers RO3010 is a cost-effective, ceramic-filled PTFE composite material offering:
High dielectric constant (10.2±0.3) with excellent stability
Broadband performance across wide frequency ranges
Superior dimensional stability (CTE matched to copper)
Circuit miniaturization capabilities
Ideal for automotive radar, cellular systems, and satellite communications requiring stable high-frequency performance.
2.Key Performance Features
Dielectric Constant: 10.2±0.3 @10GHz
Dissipation Factor: 0.0022 @10GHz
CTE: 13/11/16 ppm/°C (X/Y/Z)
Thermal Conductivity: 0.95 W/mK
Moisture Absorption: 0.05%
Operating Temp: -40°C to +85°C
3.PCB Specifications at a Glance
Specification |
Details |
Base Material |
Rogers RO3010 |
Layer Configuration |
4-layer |
Board Dimensions |
35mm × 42mm |
Trace/Space |
6/9 mils |
Minimum Hole Size |
0.4mm |
Via Technology |
Blind vias (L1-L2) |
Board Thickness |
2.7mm |
Copper Weight |
1oz (outer layers) |
Via Plating |
20μm |
Surface Finish |
Immersion Tin |
Silkscreen |
None (Top/Bottom) |
Solder Mask |
None (Top/Bottom) |
Quality Assurance |
100% Electrical Tested |

4.PCB Stackup: 4-layer rigid PCB
Layer |
Type |
Thickness |
Material |
1 |
Top Layer |
35 μm Cu |
- |
- |
Core |
1.27mm |
Rogers RO3010 Substrate |
2 |
Inner Layer |
35 μm Cu |
- |
- |
Prepreg |
0.05mm |
1060 x1 Bonding Ply |
3 |
Inner Layer |
35 μm Cu |
- |
- |
Core |
1.27mm |
Rogers RO3010 Substrate |
4 |
Bottom Layer |
35 μm Cu |
- |
5.PCB Statistics:
Components: 4
Total Pads: 12
Thru Hole Pads: 2
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 4
Nets: 3
6.Typical Applications
Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems - power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
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